Aluminum silicon carbide AlSiC ( SICP/Al or Al/SiC, SiC/Al) is the first to realize the large-scale industrialization of electronic packaging materials, meeting the requirements of the increase in the integration of semiconductor chips along Moore's Law, leading to a sharp increase in chip heat generation, a decrease in service life, and the development of "light, thin and small" electronic packaging need. Especially in aerospace, microwave integrated circuits, power modules, military radio frequency system chips and other packaging analysis, it has become an important trend in the application and development of packaging materials.

As a kind of particle reinforced metal matrix composite material, using Al alloy as matrix, according to the design requirements, in a certain form, proportion and distribution state, SiC particles are used as reinforcing bodies to form multi-phase composite materials with obvious interfaces, which have comprehensive superior properties that single metal does not have.

The research and development of AlSiC is earlier, and the theoretical description is relatively perfect. Some varieties take the lead in realizing the scale industrialization of electronic packaging materials, meeting the requirements of the improvement of semiconductor chip integration along Moore's law, leading to the sharp rise of chip calorific value, reduced service life and the development demand of "light, thin and tiny" electronic packaging. Especially in aerospace, microwave integrated circuits, power modules, military radio frequency system chips and other packaging and analysis functions are very prominent, becoming an important trend in the application and development of packaging materials.

Application Cases

	Processing method: milling process
	Tool used: D4 PCD end mill
	Use machine: Seiki
	Processing part: step cleaning
	Application industry: satellite parts Aluminum based silicon carbide
	Use effect: the service life of a single cutting edge is 4 hour